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After reviewing some of the literature on Instructional Design & Technology, what is a gap in the literature or a specific area of inquiry that you would like to investigate in this course? What are some IDT problems that remain unsolved? In 500 words or less, describe the IDT problem you have identified and would like to research further through a review of the literature and through development of an original research study proposal.
Then, write one main research question plus two or three related sub-questions that you would like to answer through the research study you will propose in this course. What question might you try to answer through an original research study to move the field forward and innovate? These questions should help you solve the problem you identified in the first part of this assignment and should thus include similar key words, concepts, and ideas.
NOTE: You will NOT be carrying out the research proposal you are developing during this course with real participants. You are merely proposing a potential study you may want to conduct as part of your dissertation later in your program. The instructor of this course will give you feedback on your research proposal to ensure you have sufficient understanding of what a doctoral level research study in IDT will entail. If you have questions about the difference between a research proposal and a research study/investigation, please don’t hesitate to ask your instructor.
Integrated Device Technology (IDT) Problem
The primary purpose of the research was to identify various defects associated with the
Integrated Circuit (IC) using problem
solving tools. The study further suggests that the primary
concern of the IC packaging industry is defects since they can
occur at any stage of production. It
is worthwhile noting that Integrated Device Technology (IDT) is a company under the
semiconductor and IC industry. Therefore, a feasible solution will result after identifying the root
of the defects. The article utili
zed simple visual tools like stratification and Ishikawa diagram.
Also, the journal employs a Pareto analysis, which is a statistical tool. Ultimately, the authors
carried out experiments using the Taguchi design. These tools indicate that the researchers
both quantitative and qualitative approaches to analyze the results. It is essential to understand
that the results showed the highest number of defects in 6SC70M, 6SOT23M, and 5SC70M IC
areto analysis indicated that molding was the
chief cause of the errors in AC.
For instance, it contributes 62.96 and 57.14 percent of 6SOT23M and 5SC70M respectively.
The notable aspect of the entire research is how authors strive to increase the reliability of
their results. For instance,
after the identification of the defective packages, still, the author
employs stratification to confirm the results. Furthermore, the research narrow down to the
actual cause of the defects in the AC. Ultimately, the use of graphs and tables enable the
udience to understand the relationship between the variables; therefore, it will be easy to
conclude. However, Apart from the tools, what are other techniques or methods that can be used
to identify AC defects?
It is significant to understand that my topic was about challenges that semiconductors
companies encountered during manufacturing. Therefore, it was essential to focus on IDT since
it is an example of Semiconductor Company. The article was beneficial becau
se it provides a
coherent analysis of various problems that are common in all corporations dealing with products
such as attenuators, switches, and IC. Furthermore,
have not only under
stood the challenges
but also tools used to identify them